Description
COOTECK adhesives use a unique low temperature curing technology, to meet the low temperature curing requirement of heat-sensitive components, it is adapt to high temperature lead-free wave soldering. According to the various technological requirement of R&D, COOTECK SMT Adhesives have a extreme wide operating window, which is suitable for all electronics manufacturers processing applications.
Features
◆ One-component heat curing epoxy adhesive
◆ For high-speed or manual dispensing machine Scratch
◆ Good storage stability
◆ Wider process window
◆ Excellent heat resistance
◆ For wave soldering surface mount components prior to bonding
Specification
Model |
Color |
Density
g/cm3 |
Viscosity mPa.s |
Thixotropic index |
Tg
℃ |
Curing conditions |
Remarks |
COO306 |
Red |
1.1-1.3 |
500 |
.≥6.8 |
≥110 |
60s@150℃ |
General Dispensing |
COO306H |
Red |
1.1-1.3 |
350 |
≥6.5 |
≥90 |
60s@150℃ |
High-speed Dispensing |
COO316 |
Red |
1.1-1.3 |
350 |
≥6.5 |
≥110 |
60s@150℃ |
Halogen-free, High-speed Dispensing |
COO356 |
Red |
1.1-1.3 |
350 |
≥6.5 |
≥75 |
60s@150℃ |
Excellent moisture resistance performance |
COO326 |
Red |
1.4 |
512 |
≥6.8 |
≥45 |
100s@100℃ |
Low temperature, Halogen-free adhesive |
COO308 |
Red |
1.1-1.3 |
560 |
≥5 |
≥110 |
60s@150℃ |
General adhesive |
COO318 |
Red |
1.1-1.3 |
560 |
≥6.5 |
≥110 |
60s@150℃ |
Halogen-free adhesive
Stencil print |
COO318H |
Red |
1.1-1.3 |
600 |
≥5 |
≥110 |
60s@150℃ |
Halogen-free adhesive
Stencil print |
Other specifications can be produced according to customer demand