Products

E-Adhesives Series

Home>Products>E-Adhesives Series

Description

       COOTECK adhesives use a unique low temperature curing technology, to meet the low temperature curing requirement of heat-sensitive components, it is adapt to high temperature lead-free wave soldering. According to the various technological requirement of R&D, COOTECK SMT Adhesives have a extreme wide operating window, which is suitable for all electronics manufacturers processing applications.

 

Features

 One-component heat curing epoxy adhesive        

 For high-speed or manual dispensing machine Scratch

 Good storage stability                                  

 Wider process window

 Excellent heat resistance                     

 For wave soldering surface mount components prior to bonding

 

Specification

Model

Color

Density

g/cm3

Viscosity mPa.s

Thixotropic index

Tg

Curing conditions

Remarks

COO306

Red

1.1-1.3

500

.≥6.8

≥110

60s@150℃

General Dispensing

COO306H

Red

1.1-1.3

350

≥6.5

≥90

60s@150℃

High-speed Dispensing

COO316

Red

1.1-1.3

350

≥6.5

≥110

60s@150℃

Halogen-free, High-speed Dispensing

COO356

Red

1.1-1.3

350

≥6.5

≥75

60s@150℃

Excellent moisture resistance performance

COO326

Red

1.4

512

≥6.8

≥45

100s@100℃

Low temperature, Halogen-free adhesive

COO308

Red

1.1-1.3

560

≥5

≥110

60s@150℃

General adhesive

COO318

Red

1.1-1.3

560

6.5

≥110

60s@150℃

Halogen-free adhesive

Stencil print

COO318H

Red

1.1-1.3

600

≥5

≥110

60s@150℃

Halogen-free adhesive

Stencil print

Other specifications can be produced according to customer demand