Description

      Cooteck Low Temperature Cure Adhesive is a one component heat curing epoxy resin, curing at low temperatures, and to achieve good curing properties instantly. Its typical applications include: CCD / CMOS module components, especially for heat-sensitive components.

 

Features

◆  One component epoxy adhesive
◆  Good bonding properties suitable for variety materials

◆  High structural strength
◆  Low-temperature, fast-curing

 

Specification

Model	Color	Density g/cm3	Viscosity mPa.s	Tg℃	Tthermal expansion coefficient ppm/℃	Curing conditions	Storage temperature℃	Remarks
COO502	Black	1.4	9000 -12000	67	40-185	20min@80 ℃	-15~ -25	Halogen-free
COO502B	Black	1.4	5000 -8000	69	40-180	15min@80℃	-1.5~ -25	Halogen-free

Other specifications can be produced according to customer demand