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E-Adhesives Series

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Description
      Heat conduction adhesives with heat conduction, fixed and insulation properties, is easy to operate on assembly, for there is no need for mechanical fastening clips. It provides efficient heat transfer between electronic components and heat sinks.

 

Features
  Superior thermal conductivity
  Re-workable, easy to disassemble
  Curing at room temperature
  Applicable in harsh condition

 

Specification

Model

Density g/cm3

Viscosity mPa.s

Shear strength N/mm2

Thermal expansion coefficient ppm/

Thermal conductivity Wm-K

Curing speed,

initial solid/all solid

COO338

1.61

Cream

5.2

70

0.8

5min/24h

Other specifications can be produced according to customer demand.