Description
Heat conduction adhesives with heat conduction, fixed and insulation properties, is easy to operate on assembly, for there is no need for mechanical fastening clips. It provides efficient heat transfer between electronic components and heat sinks.
Features
◆ Superior thermal conductivity
◆ Re-workable, easy to disassemble
◆ Curing at room temperature
◆ Applicable in harsh condition
Specification
Model |
Density g/cm3 |
Viscosity mPa.s |
Shear strength N/mm2 |
Thermal expansion coefficient ppm/℃ |
Thermal conductivity Wm-K |
Curing speed,
initial solid/all solid |
COO338 |
1.61 |
Cream |
≥5.2 |
70 |
0.8 |
5min/24h |
Other specifications can be produced according to customer demand.