Description
       COOTECK Dam&Fill adhesive is used for the encapsulate of IC packaging, such as protection to circuit board and other products. The product has excellent solder ability and moisture resistance, low thermal expansion coefficient to reduce warpage and cracking, excellent thermal shock performance and fast mobility.

 

Features
◆  One component heat curing epoxy adhesive
◆  Good in shape
◆  Low water absorption, low shrinkage
◆  Good storage stability

 

Specification

Model	Color	Density g/cm3	Thixotropic index	Tg℃	Thermal expansion coefficient    ppm/℃	Curing condition	Storage temperatur ℃	Remarks
COO109D/F	Grey	1.46-1.49	4.45-1.08	132	10-15	1.5h@125℃	5	General
COO119D/F	Grey	1.46-1.49	4.45-1.08	132	10-15	1.5h@125℃	5	Halogen -free

Other specifications can be produced according to customer demand。